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Especificaciones Número de pieza del fabricante: X11SPI-TF-O CPU: LGA3647 Compatible con procesador escalable Intel Xeon Admite hasta 205 W TDP Hasta 28 núcleos Conjunto de chips: Intel C622 Memoria: 8 ranuras DIMM DDR4-2666/2400/2133/1866/1600 MHz de 288 pines
HPE Proliant Dl385 Gen10
Hyperscale and cloud data centers requiring massive storage density
0BA8 module supports multiple digital and analog inputs and outputs
intel r2312wftzs compatible memory BELL Especificaciones Número de pieza delNEMIX RAM memory upgrades compatible with Intel R2312WFTZS, and backed by a Lifetime Warranty.
US$ 16.99
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US$ 57500.00
US$ 45000.00
US$ 70.00